One-stop contract manufacturing

Manufacturing on Demand for the Semiconductor Industry

We machine vacuum chamber flanges, gas manifolds, electrode plates and wafer handling arms in 6061 aluminium and 316L stainless. ISO 9001:2015 certified, RFQ answered in 24 hours.

Machined aluminium vacuum chamber flange with viewport, a stainless gas manifold and a wafer handling end effector

Build Semiconductor Hardware Without Waiting on Tooling

Three things you get on every job, whether it is one part or a hundred.

One supplier, every process

CNC machining, vacuum casting, injection moulding, sheet metal and 3D printing in one factory. A project never gets handed between suppliers halfway through.

Quoted in 24 hours

Send a STEP file and we come back inside a working day with price, lead time and any manufacturability notes worth raising before you commit.

Measured, not assumed

±0.01 mm on machined metal. A dimensional report ships with every batch and material certificates are available on request.

Vacuum Hardware From Prototype to Production

Semiconductor process tools run under vacuum, so the sealing face matters as much as the profile. We machine chamber flanges, viewport rings and gas manifold blocks from 6061 aluminium and 316L stainless, holding ±0.01 mm on bores and bolt circles and finishing O-ring grooves and sealing faces to Ra 0.8 µm or better. Parts are deburred, degreased and double-bagged before packing, because a loose chip in a gas line ends a wafer run. First articles ship in 2-7 days; once the chamber design freezes, the same programmes and fixtures run 7-15 day batches, with in-house steel tooling for the moulded and cast parts around them.

Top Semiconductor Equipment Applications

  • Vacuum chamber flanges in 6061 aluminium, ISO-K and CF
  • Wafer handling arms and end effectors in 6061-T6
  • Gas manifold blocks in 316L stainless, cross-drilled
  • Electrode plates and backing rings in 6061 aluminium
  • Showerhead plates in 316L with 0.5 mm gas hole arrays
  • Viewport retaining rings and blank-off plates in 316L

Semiconductor parts machined and finished by E-make

Who We Build Semiconductor Equipment Parts For

  • Wafer fab equipment OEMs building etch and CVD tools
  • Vacuum component suppliers needing machined flanges
  • Process gas delivery integrators and panel builders
  • Semiconductor R&D labs and university cleanrooms
  • Metrology and wafer inspection equipment makers

E-make manufacturing floor in Shenzhen

Semiconductor Manufacturing Capabilities

CNC machining of a precision aluminium component

CNC Machining for Vacuum Chamber Hardware

Chamber flanges, electrode plates, viewport rings and manifold blocks are cut on 3-, 4- and 5-axis mills and lathes to ±0.01 mm. Sealing faces and their O-ring grooves are machined in one setup, so the groove stays concentric with the bore. 6061 aluminium and 316L stainless run on separate tooling to keep steel particles out of aluminium parts. Prototypes in 2-7 days, repeat batches in 7-15.

Get a quote in 24 hoursCNC machining service

Vacuum cast polyurethane parts from a silicone tool

Vacuum Casting for Tool Covers and Jigs

Silicone tooling copies a machined master, so 10-50 polyurethane parts arrive in 5-7 days. Used for equipment covers, control panel housings, wafer cassette and carrier prototypes, and handling jigs that never see vacuum. Resins run from ABS-like to glass-filled and heat-resistant grades, cast in clear or pigmented colour, so a full tool skin can be fitted and reviewed before steel is cut.

Get a quote in 24 hoursVacuum casting service

Injection moulding tool producing a plastic housing

Injection Moulding for Wafer Carriers and Covers

Aluminium and steel tools are built in-house, with first shots in 15-30 days. Used for wafer carriers, cassette shells, connector housings, cable guides and tool fascia panels, moulded in PC, PEEK, PPS and carbon-filled static-dissipative compounds where the part sits near a wafer. Tools are stored and maintained here between runs, so a repeat order needs a set-up rather than a new tool.

Get a quote in 24 hoursInjection moulding service

Sheet metal bending of a stainless steel panel

Sheet Metal for Tool Frames and Enclosures

Laser cutting, CNC bending and TIG welding in 0.5-6 mm covers equipment frames, cleanroom-facing panels, gas box enclosures, cable trays and chase covers. Runs in 304 and 316L stainless where the panel sits inside a cleanroom, and 6061 aluminium or mild steel where it does not. Welds are ground flush, and captive nuts and standoffs are pressed in before the panel is finished.

Get a quote in 24 hoursSheet metal service

ISO 9001:2015 certified, with in-house CMM and dial-indicator inspection. Every batch ships with a dimensional report, and material certificates are traceable to the batch or heat number on request.

Semiconductor Manufacturing Services

CNC machining

Most semiconductor work lands here. 5-axis milling and turning to ±0.01 mm in 6061-T6 aluminium and 316L stainless, plus 304, titanium and PEEK on request. Sealing faces, O-ring grooves and bolt circles are cut in one setup. Deep cross-drilled gas passages are deburred and flushed before inspection.

Vacuum casting

Silicone tools taken off a CNC-machined master, 10-50 parts in 5-7 days. Used for the non-vacuum items around a tool: covers, handling jigs, wafer cassette mock-ups and control panel housings. Polyurethane resins in ABS-like, glass-filled and heat-resistant grades, with threaded inserts set during casting.

Injection moulding

Aluminium and steel tooling cut in-house, first shots 15-30 days. Semiconductor parts are the plastics around the process: wafer carriers, cassette shells, connector bodies, cable guides and fascia panels. Materials include PC, PEEK, PPS, PBT and carbon-filled static-dissipative compounds where charge on a wafer is the concern.

Sheet metal

Laser cutting, CNC bending and TIG welding from 0.5 to 6 mm. Tool frames, gas box enclosures, cleanroom panels, cable trays and blanking plates in 304 and 316L stainless, 6061 aluminium and mild steel. Welds are ground flush; stainless is passivated, aluminium anodised, mild steel powder coated.

3D printing

SLA, SLS and metal printing for parts ahead of machining. SLA for chamber-layout mock-ups and viewport fit checks, SLS nylon for handling grippers and cable routing, DMLS in 316L or aluminium for manifold bodies with internal passages a drill cannot reach. Printed parts are not used on vacuum-sealing faces.

Semiconductor Post-Processing Capabilities

  • Bead blasting for chamber interiors
  • Hard anodising on 6061 parts
  • Passivation of 316L stainless
  • Vacuum sealing faces polished
  • Laser-marked serial numbers
  • Powder coating on tool frames

Anodised and bead blasted components after finishing

Have a drawing ready?

Send the STEP file and your flange, groove and finish callouts, and you will have a quoted price and lead time within 24 hours.

Send a STEP file